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Polyimide Masking Tape

The Polyimide Masking Tape is a high-performance masking solution designed for applications that require excellent high-temperature resistance, particularly in printed circuit board (PCB) manufacturing. This tape can withstand solder fluxes, molten solder, and cleaning solvents while ensuring clean removal without leaving any adhesive residue. With a removable silicone adhesive and a durable polyimide film, it provides reliable protection during various manufacturing processes.

Technical Specifications

  • Material Type: Polyimide
  • Finish: Gloss
  • Adhesive Type: Removable Silicone

Performance Properties

  • Short-Term High Service Temperature: No visible effect after 10 minutes at 464°F (240°C)
  • Long-Term High Service Temperaure: No visible effect after 30 days at 320°F (160°C)
  • Wave Solder Simulation: No visible effect after 10 seconds in molten solder at 518°F (270°C)

Physical Properties

  • Adhesion to Surfaces:
    • Stainless Steel: 13 oz/in (14 N/100 mm)
    • Epoxy PC Board: 13 oz/in (14 N/100 mm)
  • Thickness:
    • Film: 0.0010 inch (0.025 mm)
    • Adhesive: 0.0015 inch (0.038 mm)
    • Total (excluding liner): 0.0025 inch (0.063 mm)
  • Tack: 18 oz (515 g)
  • Tensile Strength and Elongation: 31 lbs/in (543 N/100 mm), 58%
  • Dielectric Strength: 6500 volts

Chemical Resistance:

The tape has been tested against various chemicals, showing no visible effect or leaving adhesive residue upon removal in most cases, ensuring it is suitable for harsh environments.

Shelf Life:

  • Storage Conditions: Two years from the date of receipt when stored in original packaging at or below 80°F (27°C) and 60% RH.

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